DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision Processing Tools and Other Products. The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers dicing blades, grinding wheels and dry polishing wheels. The Other Products handles accessory equipment and its related products. The company was founded on May 5, 1937 and is headquartered in Tokyo, Japan.